PART 01 Introduction
Today marks the first day of the 2026 Open Data Center Conference (ODX) and the inaugural Computing Expo. At 9:00 AM, just as the doors opened at the China National Convention Center Phase II, crowds had already gathered in front of YMIN’s two exhibition areas: Booth B11 (Supercapacitors) and Booth B12 (Electrolytic Capacitors). Server architects, power supply engineers, and storage solution providers traveled from across the country, heading straight for YMIN’s booths.
PART 02 On-Site Report: Booth Highlights
Booths B11 (Supercapacitor Zone) and B12 (Electrolytic Capacitor Zone)—the slogan “For Capacitor Application Challenges, Turn to YMIN” was prominently displayed at both locations.
Engineers from four key sectors—server power supply design, enterprise-grade SSD manufacturing, AI computing board development, and data center infrastructure—arrived with specific component selection requirements, keeping the booths buzzing with inquiries and discussions.
PART 03 AI Server Main Power Supply Solutions
Engineers gathered around the power solution display board, engaged in lively discussion; this was the most frequently inquired-about application area of the day. YMIN showcased liquid snap-in and polymer hybrid aluminum electrolytic capacitors, covering the entire chain of needs from AC-DC input filtering to PSU output-side energy storage.
Liquid Snap-in Aluminum Electrolytic Capacitors (IDC3 Series): Featuring low ESR and high ripple current resistance achieved through laser welding technology, these capacitors have been adopted into 4.5kW–8.5kW power supply solutions. They offer a one-stop selection range of 16V–630V and are suitable for applications such as Solid-State Transformers (SST).
Polymer Hybrid Aluminum Electrolytic Capacitors (NHX/NHT Series): Combining the self-healing properties of liquid electrolytes with the low-ESR advantages of polymers, these capacitors offer pin-to-pin compatibility with mainstream Japanese models, requiring no PCB modifications. Backed by domestic manufacturing facilities, they ensure rapid 4-week delivery, eliminating the long 10+ week wait times often associated with Japanese brands.
PART 04 SSD Storage Applications
Three major product lines—polymer tantalum capacitors, liquid-type leaded capacitors, and hybrid polymer-liquid capacitors—were displayed side-by-side. Engineers examined the samples closely, making repeated comparisons for component selection; this was the area where attendees lingered the longest to view the products.
Polymer Tantalum Capacitors (TQD/TQW Series): Designed specifically for slim SSDs and high-reliability PLP (Power Loss Protection) energy storage. A single unit can replace multiple MLCCs; they exhibit no capacitance drop due to DC bias and no audible noise (piezoelectric effect). Their ultra-thin profiles (1.5mm/1.9mm) are ideal for compact SSD form factors like E1.S and E3.S.
Liquid-Type Leaded Aluminum Electrolytic Capacitors (LKL/LKF Series): Feature specially designed 0.8mm leads that deliver double the vibration resistance and offer high-temperature durability (130°C/5,000 hours). Engineered for SSD PLP circuits, they provide a sufficient protection window for data flushing from cache to flash memory.
Hybrid Polymer Aluminum Electrolytic Capacitors (NGY/NHT Series): Combine high energy storage capacity with low ESR (up to 3300μF per unit). They balance high performance with cost-effectiveness and support a wide range of operating temperatures and voltages.
PART 05 Motherboard Computing Applications
Polymer tantalum capacitors and stacked polymer solid aluminum electrolytic capacitors were showcased in close proximity to CPU/GPU units. Board solution providers engaged in on-the-spot technical discussions here, making this the area with the highest volume of inquiries.
Polymer Tantalum Capacitors (TQD Series): Feature a bottom-terminal structure that increases the tantalum core volume by 18% within the same footprint, allowing for greater charge storage on limited PCB real estate. Their rapid frequency response makes them suitable for energy storage and filtering in high-frequency circuits.
Stacked Polymer Solid Aluminum Electrolytic Capacitors (MPS/MPD Series): Utilize a stacked structure to achieve high capacitance in a compact size. The MPS series offers ESR as low as 9mΩ, while the ultra-thin profile (as low as 1.0mm) saves space on high-density boards and provides nanosecond-level transient response support for CPUs and GPUs.
PART 06: Supercapacitors—BBU Backup Power, RAID Write Cache, and SSD PLP
From BBU backup power and RAID write cache protection to SSD PLP (Power Loss Protection), this area—where engineers often lingered for half an hour at a time—hosted the event’s most in-depth technical discussions.
SLF Hybrid Supercapacitor (BBU Scenario): 4.0V/4500F, ESR ≤0.8mΩ, 1 million cycles. It outperforms key specs of the Japanese Musashi 3.8V/300F model, enabling domestic substitution and mitigating risks associated with price hikes and supply instability in overseas supply chains.
SDM EDLC Supercapacitor Module (RAID Write Cache Protection): 13.5V/8F, -40°C to +70°C, ≥200,000 cycles. Designed for direct installation into RAID card backup power interfaces, it engages automatically the instant power is lost.
SDN Snap-in EDLC Supercapacitor (SSD PLP): Single cell 2.7V/180F; a 5S4P module configuration yields 13.5V/144F. Compatible with 12V platforms, it provides power loss protection for AI storage drives.
PART 07: Keynote Speech—Synergy in Computing Power Technology
This morning (10:10–10:30), YMIN Electronics delivered its first keynote speech at the Server Sub-forum (Venue 5): “YMIN Supercapacitor Solutions for Server Main and Backup Power.” The session was packed to capacity, and the booth saw a second surge of inquiries immediately following the presentation.
On September 4, YMIN will deliver a second speech at the Storage Components Sub-forum (Venue 5): “Applications of YMIN Capacitors in SSDs.” We invite you to attend and join the discussion.
PART 08: Two Days Remaining
From AI server main power supplies to SSD storage, and from motherboard computing power to full-chain supercapacitor support—YMIN now offers a comprehensive capacitor solution portfolio covering the four key scenarios of AI data centers. With two days remaining (September 3–4), the B11 Supercapacitor and B12 Electrolytic Capacitor exhibition zones remain open. If you are seeking domestic alternatives for AI server power supplies, or looking for the optimal capacitor solutions for SSD PLP (Power Loss Protection), motherboard CPU/GPU transient power delivery, or BBU backup systems, we invite you to visit us and discuss your specific requirements.
Complete datasheets and selection guides are available on-site, alongside one-on-one consultations with FAE engineers and opportunities to request samples.
For any capacitor application challenges, turn to YMIN. We are ready to meet your needs through three accessible channels: the exhibition booth, our official website, and direct contact with FAEs.
YMIN Booths: B11 (Supercapacitors) & B12 (Electrolytic Capacitors) | Dates: September 2–4 | Venue: China National Convention Center Phase II, Beijing.
Post time: Sep-03-2026