From September 2nd to 4th, 2026, the 2026 Open Data Center Conference (ODX) and the inaugural China International Computing Expo will be grandly opened at the China National Convention Center Phase II in Beijing. Shanghai YMIN Electronics Co., Ltd. will make a major appearance in the B11 Supercapacitor Booth and B12 Electrolytic Capacitor Booth.
At this exhibition, YMIN’s electrolytic capacitor booth will focus on three core application scenarios: AI server main power supply, SSD storage, and motherboard computing power, showcasing a multi-category product matrix including liquid horn-shaped, liquid plug-in, polymer hybrid, polymer tantalum, and multilayer polymer solid electrolytic capacitors. This article focuses on the motherboard computing power scenario, detailing how YMIN’s capacitor solutions provide nanosecond-level transient support for AI server CPU/GPU power supply.
Motherboard Scenarios
Two Product Lines Working Together to Solidify the Foundation of Computing Power Supply
AI server CPU/GPU power consumption fluctuates dramatically during instantaneous events. The capacitors at the power supply end need to respond to nanosecond-level current changes with extremely low ESR to prevent voltage sag leading to frequency reduction or restarts. Simultaneously, they need to provide a low-impedance path in the MHz band to suppress high-frequency ripple interference with high-speed signals.
YMIN has developed two major product lines for motherboard computing scenarios: polymer tantalum capacitors and multilayer polymer solid aluminum electrolytic capacitors (MLPC). These products closely align with CPU/GPU deployments, providing the final layer of protection for AI chip power supply.
Polymer Tantalum Capacitors
YMIN’s TQD series polymer tantalum capacitors utilize a new generation of bottom-side terminal structure, combining high capacitance density with fast frequency response characteristics. They are suitable for energy storage and filtering in high-frequency circuits surrounding CPU/GPUs.
| series | img | Voltage | capacity | size |
| TQD 105℃ / 2,000H | 20V | 47μF | 7.3×4.3×1.5mm | |
| 16V | 100μF | 7.3×4.3×1.9mm | ||
| 25V | 68μF | 7.3×4.3×1.9mm | ||
| 25V | 100μF | 7.3×4.3×1.9mm |
Key Advantages:
High Capacitance Density: The tantalum core volume is increased by 25% for the same bottom terminal structure, storing more charge within a limited PCB area.
Fast Frequency Response: Suitable for energy storage and filtering in high-frequency circuits, reducing the impact of high-frequency noise on the circuit.
Thin Packaging: 1.5mm/1.9mm ultra-thin package, adaptable to high-density motherboard layouts.
Low ESR: Provides efficient and stable transient response in CPU/GPU peripheral power supply scenarios.
Layered Polymer Solid Aluminum Electrolytic Capacitors
YMIN MPS/MPD19/MPD28 series layered polymer solid aluminum electrolytic capacitors achieve small size, large capacitance, low ESR, low leakage current, and high reliability through a layered structure. Specifically designed for AI server CPU/GPU peripheral power supply, they provide efficient and stable transient response for high-density computing boards.
| Product Series | img | Voltage | capacity | size |
| MPS 105℃ / 2,000H |
/ | 25V | 470μF | |
| MPD19 105℃ / 2,000H |
16V | 100μF | 7.3×4.3×1.9mm | |
| 20V | 22μF | |||
| 25V | 22μF | |||
| 25V | 47μF | |||
| 25V | 68μF | |||
| MPD28 105℃ / 2,000H |
/ | 16V | 150μF | 7.3×4.3×2.8mm |
| 16V | 220μF | |||
| 25V | 100μF |
Core Advantages:
Ultra-Low ESR: The MPS series boasts an ESR as low as 9mΩ, effectively reducing power conversion energy loss.
Small Size, Large Capacitance: 7.3×4.3mm ultra-thin package (as thin as 1.0mm), allowing for close placement against the CPU/GPU without encroaching on valuable PCB space.
Low Leakage Current: The new bottom electrode structure eliminates the need for bending, avoiding secondary damage to the chip package and maintaining consistent leakage current.
High Reliability: Meets the 105℃/2,000H lifespan rating, suitable for high-reliability applications.
Two Keynote Speeches & In-Depth Technical Sharing
In addition to product demonstrations, ymin Electronics will also deliver keynote speeches at two core sub-forums of this Computing Expo:
September 2nd | Session 5 · Server Sub-Forum:
ymin Supercapacitors’ Solutions in Server Main (Backup) Power Supplies
September 4th | Session 5 · Storage Components Sub-Forum YMIN Capacitors in SSD Applications
Meet in Beijing for a Computing Power Feast
The 2026 China International Computing Expo (CICI) is themed “Open Computing Power Ecosystem, Token-Driven Innovation.” Over 8,000 square meters of exhibition space will showcase a full range of products and solutions, including computing chips, liquid cooling technology, and intelligent computing clusters.
YMIN’s full-scenario SSD capacitor solutions are ready. Whether you are designing PLP protection circuits for enterprise-grade SSDs or looking for highly reliable capacitors for storage solutions in liquid-cooled environments—OEMs, server solution designers, and data center architects are welcome to visit the electrolytic capacitor booth (B12) to obtain datasheets, selection advice, and FAE technical support.
We look forward to exchanging ideas with you face-to-face about the latest technological breakthroughs in capacitors for AI storage, and jointly promoting China’s computing power industry from “usable” to “easy-to-use, user-friendly, and high-quality”!
Post time: Aug-28-2026