TQD19

Short Description:

◆ Ultra-thin design (L7.3×W4.3×H1.9)

◆ Bottom-mounted terminals, low ESL

◆ Low ESR, high ripple current

◆ RoHS compliant (2011/65/EU)


Product Detail

Product Tags

ItemSpecification
Operating Temperature Range-55~+105℃
Rated Working Voltage16~35V
Capacity Range33~220μF 120Hz/20℃
Allowable Capacity Deviation±20%(120Hz/20℃)
Dissipation Factor (tanδ)The value is lower than the value in the standard product list at 120Hz/20℃.
Leakage CurrentThe value is lower than that in the standard product list. Charge for 5 minutes at the rated voltage at 20°C.
Equivalent series resistance (ESR)The value is lower than the value in the standard product list at 100kHz/20℃.
Surge voltage (V)1.15 times the rated voltage
DurabilityUnder rated temperature, apply rated working voltage for 2000 hours, then store at 20℃ for 16 hours; the product shall meet:
- Capacitance Change Rate≤±20% of the initial value
- Dissipation Factor (tanδ)≤150% of the initial specification value
- Leakage Current≤Initial specification value
High Temperature & HumidityStore at 60℃, 90%-95% humidity for 500 hours without applying voltage, then store at 20℃ for 16 hours; the product shall meet:
- Capacitance Change Rate-40%~+20%
- Dissipation Factor (tanδ)≤150% of the initial specification value
- Leakage Current≤300% of the initial specification value
tqd19的尺寸图(1)

Rated Ripple Current Temperature Coefficient:

Temperature-55℃ < T ≤ 45℃45℃ < T ≤ 85℃85℃ < T ≤ 105℃
Rated 105°C Coefficient10.70.25
Note: The surface temperature of the capacitor shall not exceed the maximum operating temperature of the product.
 
Rated Ripple Current Frequency Correction Factor
Frequency (Hz)120Hz1kHz10kHz100~300kHz
Correction Factor0.10.450.51

Standard Product List

Rated Voltage (V)Rated Temperature (℃)Category Voltage (V)Category Temperature (℃)Nominal Capacity (μF)Product Dimensions (mm)Leakage Current (μA, 5min)Tanδ (120Hz)ESR (mΩ 100KHz)Rated Ripple Current (mA r.m.s) at 45℃ 100KHz
LWH
16105℃16105℃1007.34.31.91600.1502200
105℃16105℃2207.34.31.93520.1502200
25105℃25105℃337.34.31.982.50.1601900
105℃25105℃1007.34.31.92500.1601900
35105℃35105℃687.34.31.9164.50.11001400
105℃35105℃687.34.31.9164.50.11201200

Product Details:

YMIN TQD19 Series Ultra-Thin Solid-State Capacitors: Injecting Stable Core Power into Modern High-Density Electronic Equipment

In today's era of electronic engineering, where ultimate efficiency and compact space are paramount, every cubic millimeter of layout is crucial, and every fluctuation in current affects the overall stability of the system. Engineers constantly face the same core challenge: how to achieve more efficient, reliable, and powerful power management within increasingly limited spaces? YMIN understands this well, and leveraging its profound expertise in materials science and electronic engineering, proudly presents the TQD19 series of ultra-thin chip solid-state electrolytic capacitors—a masterpiece designed to push the limits of space and performance.

From slim and portable smartphones and laptops to highly integrated server motherboards and graphics cards; from sophisticated industrial control boards to high-speed communication network equipment, electronic product design is rapidly evolving towards "high density, high frequency, and miniaturization." While traditional electrolytic capacitors offer stable performance, their bulky size, high equivalent series resistance (ESR), and poor high-frequency characteristics have become bottlenecks restricting further simplification and performance improvement of circuit boards. Especially in high-frequency switching power supplies and CPU/GPU core power supply circuits, the size, ESR value, and ripple current withstand capability of capacitors directly determine the purity, conversion efficiency, and long-term reliability of the power supply and the entire system.

The YMIN TQD19 series was created to end this "game." With its iconic ultra-thin design (L7.3×W4.3×H1.9mm), it redefines the performance standards for miniaturized capacitors, successfully achieving a perfect balance between superior electrical performance and astonishing power density within a small footprint.

1. Ultra-thin form factor, unleashing layout potential

The TQD19's extremely thin design is its most intuitive competitive advantage. Its standing height of only 1.9mm allows it to easily fit into the narrow gaps between the motherboard and casing of mobile devices, or be densely arranged around large chips, "lightening the load" on valuable PCB board space. This provides device designers with unprecedented layout flexibility, allowing them to achieve more complex functional integration or design products that are more stylish and thinner.

2. Bottom Electrode, Optimized High-Frequency Performance

This series employs an advanced bottom electrode structure. This design not only facilitates surface mount technology (SMT) production, improving soldering reliability and manufacturing efficiency, but more importantly, it effectively shortens the internal current path, significantly reducing the equivalent series inductance (ESL). Low ESL means lower impedance for the capacitor at high frequencies (e.g., 100kHz and above), resulting in superior decoupling and filtering performance, and enabling rapid response to instantaneous current changes in the load, providing a clean and stable core voltage for high-speed digital chips (such as CPUs, GPUs, and ASICs).

Unlike traditional liquid electrolytic capacitors, the TQD19 uses a highly conductive organic polymer as the solid electrolyte. This fundamental material change brings multiple core advantages:

• Low ESR (Equivalent Series Resistance): The solid electrolyte has extremely high conductivity, allowing the TQD19 to achieve an astonishing ESR of 50-120mΩ (depending on voltage and capacitance) at 100kHz. Low ESR directly translates to lower power loss and self-heating, significantly improving power conversion efficiency.

• High Rated Ripple Current Capability: Thanks to its low ESR characteristics, the TQD19 can withstand ripple currents up to 2200mA (@100kHz, 45℃). In switching power supplies, ripple current is the main cause of capacitor heating. This strong ripple current handling capability ensures the capacitor operates at low temperatures under harsh conditions, significantly extending its lifespan.

• No Leakage Risk, Longer Lifespan: Solid-state electrolytes eliminate the risk of liquid electrolyte drying or leakage, allowing the capacitor to remain stable even in harsh environments such as high temperature, high humidity, and strong vibration. Its 2000-hour @105℃ durability test and stable performance in high temperature and high humidity tests fully demonstrate its excellent long-term reliability, making it particularly suitable for applications in industrial, automotive, and communication infrastructure fields with extremely high requirements for lifespan and stability.

The YMIN TQD19 series, with its comprehensive advantages, has become the ideal choice for the following high-end application scenarios:

1. Computing and Data Centers: As a decoupling and filtering capacitor in the power circuits of server motherboards, GPU accelerator cards (such as NVIDIA H200), and high-performance computing clusters, it provides extremely clean power to powerful computing cores, acting as an "invisible guardian" ensuring the stability of high-speed data processing and storage.

2. Communication Infrastructure: In the power management modules of 5G base stations, network switches, and routers, the TQD19 effectively suppresses high-frequency noise, ensuring the integrity of signal transmission and building a stable and reliable foundation for communication networks.

3. Consumer Electronics: In the circuit design of ultra-thin laptops, high-end graphics cards, and smart wearable devices, its miniaturization advantages are undeniable, helping to achieve lighter, thinner, and longer-lasting product designs.

4. Industrial and Automotive Electronics: In industrial automation control boards, in-vehicle infotainment systems, and sensor modules of Advanced Driver Assistance Systems (ADAS), its high reliability and wide-temperature characteristics can withstand harsh working environments, ensuring long-term trouble-free system operation.

Choose YMIN TQD19, Choose a Reliable Future

The YMIN TQD19 series of ultra-thin solid-state capacitors is more than just an electronic component; it embodies YMIN's unwavering pursuit of excellence and its profound understanding and response to customers' design needs for high density and high reliability. It integrates innovative materials science, precise manufacturing processes, and practical engineering design philosophy, successfully achieving the optimal balance between performance, size, and reliability.

In today's rapidly evolving electronic world, a high-quality basic component is the cornerstone of a superior system. Choosing the YMIN TQD19 means choosing smaller size, higher efficiency, greater stability, and a longer lifespan for your products. Let's join hands, with the TQD19 as a powerful and compact core driver, to propel electronic technology towards a smarter, more compact, and more reliable future.


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