The Hidden Heroes Behind AI Computing Power: How Domestically Produced High-Voltage Capacitors (Φ30×70mm 450V/1400µF, 105℃/3000H) Solve Three Major Challenges in Server Power Supplies

With the explosive growth of AI computing power, data centers are experiencing unprecedented upgrade pressure. As the “power heart” of AI servers, AC-DC front-end power supply design faces unprecedented challenges: how to achieve higher power density, longer lifespan, and stronger reliability within limited space? This is not only a technical issue, but also crucial to ensuring the continuous and stable output of AI computing power.

YMIN Electronics, a leading domestic capacitor solution provider with years of experience in the high-voltage capacitor field, has launched the IDC3 series of high-voltage liquid snap-on aluminum electrolytic capacitors to address the specific needs of AI server power supplies, providing an innovative technical solution to solve industry pain points.

Operating Conditions

• Location: Energy storage/filter capacitor after AC-DC front-end PFC (Power Factor Correction) DC-Link (DC bus) (typical solution)

• Power: 4.5kW–12kW+; Form factor: 1U rack-mount server power supply/data center main power supply

• Frequency: With the increasing application of GaN (Gallium Nitride)/SiC (Silicon Carbide), the switching frequency is commonly in the range of tens of kHz to hundreds of kHz (depending on the project; this article cites a specification such as 120kHz)

• Operation and Heat: Data centers commonly operate 24/7; the power supply has high internal heat density, requiring attention to capacitor case temperature/lifetime derating (typical high-temperature operating conditions)

Three Major Challenges: Unveiling the High-Voltage Capacitor Dilemma in AI Server Power Supply Design

In the design of AC-DC sections of AI server power supplies and data center main power supplies, engineers generally face three major challenges:

① The contradiction between space and capacity: In the confined space of a 1U rack-mount server, traditional standard-sized horn capacitors often face the dilemma of limited size. Achieving sufficient energy storage capacity within a limited height is a crucial challenge that must be overcome when designing high-power-density power supplies.

② Lifespan Challenges in High-Temperature Environments: AI server room environments are generally high-temperature environments, placing immense pressure on the thermal management of the power supply. The performance of the 450V/1400μF capacitor under the 105℃ high-temperature lifespan challenge directly affects the long-term reliability of the system.

③ Performance Requirements Under the Trend of Higher Frequency: With the widespread adoption of new power devices such as GaN/SiC, power supply switching frequencies are continuously increasing, placing higher demands on the ESR and ripple current capabilities of capacitors to avoid the risk of system downtime.

YMIN IDC3

Redefining the Performance Boundaries of High-Voltage Capacitors with Technology

To address the challenges mentioned above, the YMIN IDC3 series has achieved comprehensive breakthroughs in three dimensions: materials, structure, and process:

1. Density Revolution: 70% Capacitance Increase within Φ30×70mm

Utilizing a compact Φ30×70mm horn-shaped capacitor package, a high capacitance of 450V/1400μF is achieved within the typical height constraints of a standard 1U server power supply. Compared to traditional products of the same size, the capacity is increased by over 70% (compared to the typical capacity range of commonly used Φ30×70mm, 450V liquid horn-shaped capacitors in the industry), effectively resolving the contradiction between high capacity density and space.

2. Lifespan Breakthrough: Durability Tested at 105℃

Through optimized electrolyte formulation and anode foil structure, the IDC3 series exhibits excellent load lifespan performance under harsh conditions of 105℃. This design enables the capacitors to maintain long-term stability in the high-temperature environment of data centers, readily addressing the industry challenge of short lifespan due to high temperatures.

3. High-Frequency Adaptability: Tailor-made for the GaN/SiC Era

Employing a low ESR design, it can withstand higher ripple current at 120kHz. This feature allows the IDC3 series to better adapt to high-frequency switching topologies based on GaN (Gallium Nitride)/SiC (Silicon Carbide) (under datasheet specifications), providing strong support for improving the efficiency of high-power-density power supplies. Unlike traditional bus capacitor selection which focuses primarily on low-frequency ripple, high-power-density power supplies for GaN/SiC platforms require simultaneous verification of ESR and high-frequency ripple current capabilities under datasheet specifications.

Note: Key parameters in this article are from the YMIN IDC3 series datasheet/test report; unless otherwise specified, ESR/ripple current are described according to the datasheet specifications (e.g., 120kHz), and the latest datasheet version shall prevail.

Collaborative Innovation: Reliability and Performance Verification from 4.5kW to 12kW

YMIN maintains deep technical collaboration with industry-leading GaN power semiconductor manufacturers such as Navitas (according to public information). In AI server power supply projects ranging from 4.5kW to 12kW and even higher power levels, the IDC3 series high-voltage liquid snap-on aluminum electrolytic capacitors have demonstrated outstanding performance.

This collaborative development model not only verifies product reliability but also provides a solid technical foundation for the continuous evolution of AI server power supplies. YMIN’s IDC3 series has become the preferred solution for several high-end AI server projects (according to public information), with performance comparable to leading international brands.

More Than Just Products: How YMIN Provides System-Level Solutions for AI Servers

In an era of explosive growth in AI computing power, the reliability of power supply systems is paramount. YMIN Electronics deeply understands the stringent requirements of AI server power supply design and provides the industry with a complete solution that balances high capacity density, long lifespan, and high reliability through the IDC3 series.

The following is a typical selection reference for IDC3 series high-voltage liquid snap-on (substrate self-supporting) aluminum electrolytic capacitors in AI server power supplies, helping you quickly match system requirements:

Table 1: IDC3 Series High-Voltage Liquid Snap-on Capacitors – Selection Recommendations

Innovation Never Stops: YMIN Continues to Provide Stable Power for AI Infrastructure

In the era of computing power, stable power supply is fundamental. YMIN Electronics, with its IDC3 series high-voltage liquid snap-on aluminum electrolytic capacitors as the core, continuously provides reliable capacitor support for AI computing infrastructure. We not only provide products, but also system-level solutions based on deep technological understanding.

When you are designing next-generation AI server power supplies, YMIN is ready to help you break through design boundaries with technological innovation and jointly ride the wave of computing power.

Q&A Section

Q: How do YMIN’s IDC3 series high-voltage capacitors solve the pain points of AI server power supplies?

A: YMIN IDC3 series high-voltage liquid snap-on aluminum electrolytic capacitors offer solutions from three dimensions:

① High-density design – Achieving 450V/1400μF high capacitance within a Φ30×70mm size, increasing capacity by over 70% compared to products of the same size, resolving the conflict between space and capacity;

② High-temperature long lifespan – Optimized electrolyte and anode structure maintain a 3000-hour load lifespan at 105℃, improving long-term system reliability;

③ High-frequency compatibility – Employing a low ESR design, supporting 120kHz high-frequency operation, with a maximum single-cell ripple current of approximately 4.12A (500V/1700μF, 120kHz; 450V/1400μF approximately 2.75A, see selection table at the end), compatible with GaN/SiC high-frequency topologies, facilitating high-power-density power supply designs.

Summary at the end of the document

Applicable Scenarios: AI server power supply AC-DC front-end design, data center main power supply system, 1U high-density rack-mount server power supply, GaN/SiC-based high-frequency switching power supply, high power density (4.5kW-12kW+) AI computing power supply

Core Advantages:

① Dimension: Space Density, Description: Achieves 450V/1400μF within a Φ30×70mm size, with a capacity increase of over 70% compared to similar sizes, adaptable to 1U server height limitations.

② Dimension: High Temperature Lifespan, Description: Over 3000 hours of load life at 105℃, suitable for high-temperature operating environments in data centers.

③ Dimension: High-Frequency Performance, Description: Low ESR design, can withstand higher ripple current at 120KHz high frequency, adaptable to GaN/SiC high-frequency topologies.

④ Dimension: System Verification, Description: Collaborated with manufacturers such as Navitas, suitable for 4.5kW to 12kW+ AI server power supply projects.

Recommended Models

Three-Step Selection Method:

Step 1: Select the withstand voltage rating based on the bus voltage and allow for derating margin (e.g., 450–500V).

Step 2: Select the service life specification based on the ambient temperature and thermal design (e.g., 105℃/3000h) and assess the temperature rise.

Step 3: Match the dimensions according to space height/diameter constraints (e.g., Φ30×70mm) and verify the ripple current and ESR specification.