The 2026 Open Data Center Summit (ODX) and the inaugural Computing Expo will grandly open at the Phase II facility of the China National Convention Center in Beijing from September 2 to 4, 2026. Shanghai YMIN Electronic Co., Ltd. will make a major appearance, showcasing its products in the Supercapacitor Zone (B11) and the Electrolytic Capacitor Zone (B12).
At this event, YMIN’s electrolytic capacitor showcase will center on three key application scenarios—AI server main power supplies, SSD storage, and motherboard computing power—presenting a diverse product portfolio that includes liquid snap-in and radial-lead types, hybrid polymer, polymer tantalum, and stacked polymer solid-state capacitors. This article focuses on the main power supply scenario, detailing how YMIN’s capacitor solutions lay a solid power foundation for AI server power systems.
Main Power Supply Applications
Synergy Between Two Major Product Lines: Solidifying the Foundation for AI Computing Power Supply
The power density of AI servers is rapidly increasing, with 4.5kW, 8.5kW, and even 12kW becoming mainstream. Power modules must deliver higher power output within limited space, placing fourfold demands on the DC-Link bus filter capacitors located after the PFC stage: high voltage tolerance, high capacitance, low ESR, and high ripple current capability. Meanwhile, the widespread adoption of high-frequency SiC/GaN topologies requires capacitors to maintain stable filtering performance and generate less heat at higher switching frequencies.
To address the needs of main power supply applications, YMIN has developed two major product lines—liquid snap-in (PCB self-supporting) aluminum electrolytic capacitors and conductive polymer hybrid aluminum electrolytic capacitors—covering the entire chain of requirements from AC-DC input filtering to energy storage at the PSU output.
Liquid Snap-in (PCB Self-supporting) Aluminum Electrolytic Capacitors
YMIN’s IDC3 series liquid snap-in aluminum electrolytic capacitors are specifically designed for the DC-Link circuits following the PFC stage in AI server main power supplies. Through 12 technical innovations—including the replacement of traditional spot welding or riveting with laser welding—these capacitors achieve breakthroughs in both low ESR and high ripple current capability.
| IDC3 105℃ / 3,000H | |||
| Voltage | capacity | size | img |
| 450V | 1400 | Φ30×70 | |
| 475V | 1670 | Φ30×100 | |
| 475V | 1580 | Φ30×95 | |
| 475V | 2270 | Φ35×105 | |
| 500V | 1600 | Φ30×100 | |
Key Advantages:
Laser Welding Process: Minimizes contact resistance; ESR is 30% lower than conventional products.
20% Higher Ripple Current Capability: Lower temperature rise under identical conditions, resulting in significantly improved reliability and lifespan.
25%–36% Size Reduction: Smaller footprint than traditional products of the same specification, freeing up valuable PCB space.
AEC-Q200 Automotive Qualification: Meets the automotive industry’s most rigorous quality standards.
Integrated into 4.5kW–8.5kW Solutions: Developed in deep collaboration with leading global SiC/GaN solution providers, achieving power conversion efficiency exceeding 95%.
Comprehensive 16V–630V Range: Suitable for diverse applications, including Solid-State Transformers (SST).
Polymer Hybrid Aluminum Electrolytic Capacitors
YMIN’s NGY and NHT series are polymer-liquid hybrid capacitors that combine the self-healing properties of liquid electrolyte with the low-ESR advantages of polymer materials. They are specifically designed for filtering and hold-up (energy storage/power-loss ride-through) applications in AI server PSU (Power Supply Unit) main power stages and 48V DC-bus systems.
| Voltage | capacity | size | img |
| NHX (105℃ / 12,000H) | |||
| 63V | 470μF | Φ10×21 | |
| 560μF | Φ10×30 | ||
| 820μF | Φ12.5×20 | ||
| 1000μF | Φ12.5×25 | ||
| NHT (125℃ / 4,000H) | |||
| 63V | 120μF | Φ10×10 | / |
| 390μF | Φ10×20 | ||
| 80V | 47μF | Φ10×10 | |
Key Advantages:
**Pin-to-Pin Replacement for Japanese Brands:** Electrical performance and package dimensions fully benchmark against mainstream models from Japanese manufacturers like NCC and Nichicon; no PCB modifications required.
**Rapid 4-Week Delivery:** Produced in our own domestic factories, significantly shortening lead times compared to the 10+ weeks typical of Japanese brands.
**Ultra-Low ESR:** Features a hybrid solid-liquid electrolyte and composite anode process, enhancing high-frequency filtering capabilities.
**High-Temperature & Long-Life:** The NHT series supports continuous operation for 4,000 hours at 125°C.
**High Surge Current Resistance:** Individual units withstand instantaneous surge currents exceeding 20A, preventing equipment overload and system downtime.
**Comprehensive Cost Reduction:** Offers superior pricing compared to Japanese brands for equivalent quality, balancing performance with mass-production cost-efficiency.
**Two Keynote Speeches & In-Depth Technical Insights**
In addition to the product showcase, YMIN Electronics will deliver keynote speeches at two core sub-forums during the 2026 Computing Expo:
**September 2 | Venue 5 · Server Sub-forum:**
YMIN Supercapacitor Solutions for Server Main and Backup Power Supplies
**September 4 | Venue 5 · Storage Components Sub-forum:**
Applications of YMIN Capacitors in SSDs
**Join us in Beijing for this premier computing industry event**
The 2026 Computing Expo centers on the theme “Open Computing Ecosystem, Token-Enabled Inclusive Innovation.” Spanning over 8,000 square meters, the exhibition will gather products and solutions across the entire industry chain, including computing chips, liquid cooling technologies, and intelligent computing clusters.
YMIN’s full-scenario SSD capacitor solutions are ready. Whether you are designing PLP (Power Loss Protection) circuits for enterprise-grade SSDs or seeking high-reliability capacitors for liquid-cooled storage systems, we invite system OEMs, server solution designers, and data center architects to visit our **B12 Electrolytic Capacitor Booth**. Stop by to obtain datasheets, receive selection advice, and consult directly with our Field Application Engineers (FAEs).
We look forward to discussing the latest technological breakthroughs in AI storage capacitors with you in person, and working together to elevate China’s computing industry from merely “functional” to “high-performance, user-friendly, and optimized.”
Post time: Aug-29-2026